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  july 2006 FDP3651U n-channel powertrench ? mosfet ?2006 fairchild semiconductor corporation FDP3651U rev. a www.fairchildsemi.com 1 FDP3651U n-channel powertrench ? mosfet 100v, 80a, 15m ? features ?r ds(on) =13 m ? (typ.), v gs = 10v, i d = 40a ?q g(tot) =49 nc(typ.), v gs = 10 v ? low miller charge ? low q rr body diode ? uis capability (single pulse/repetitive pulse) applications ? dc/dc converters and off-line ups ? distributed power architectures and vrms ? primary switch for 24v and 48v systems ? high voltage synchronous rectifier to-220ab fdp series drain drain gate source (flang e) mosfet maximum ratings t c = 25c unless otherwise noted thermal characteristics package marking and ordering information symbol parameter ratings units v dss drain to source voltage 100 v v gss gate to source voltage 20 v i d drain current -continuous 80 a -pulsed (note 1) 220 p d power dissipation 255 w e as single pulsed avalanche energy (note 2) 266 mj t j , t stg operating and storage temperature -55 to 175 c t l maximum lead temperature soldering purposes, 1/8? from case for 5 seconds 300 c r ja thermal resistance , junction to ambient 62 c/w r jc thermal resistance , junction to case 0.59 c/w device marking device reel size tape width quantity FDP3651U FDP3651U tube n/a 50 units
FDP3651U n-channel powertrench ? mosfet FDP3651U rev. a www.fairchildsemi.com 2 electrical characteristics t j = 25c unless otherwise noted symbol parameter test conditions min typ max units off characteristics bv dss drain to source breakdown voltage i d = 250 a, v gs = 0v 100 - - v i dss zero gate voltage drain current v ds = 80v v gs = 0v - - 1 a t c =150 c - - 250 a i gss gate to source leakage current v gs = 20v - - 100 na on characteristics v gs(th) gate to source threshold voltage v gs = v ds , i d = -250 a 3.5 4.5 5.5 v r ds(on) drain to source on resistance v gs = 10v , i d = 80a - 15 18 m ? v gs = 10v , i d = 40a - 13 15 v gs =10v, i d =40a,t j =175 o c - 32 37 dynamic characteristics c iss input capacitance v ds = 25v,v gs = 0v f=1mhz - 4152 5522 pf c oss output capacitance - 485 728 pf c rss reverse transfer capacitance - 89 118 pf q g(tot) total gate charge v gs = 0v to 10v v dd = 50v i d = 80a - 49 69 nc q g(th) threshold gate charge v gs = 0v to 2v - 7 9.8 nc q gs gate to source gate charge - 23 - nc q gd gate to drain charge - 16 - nc resistive switching characteristics t (on) turn-on time v dd = 50v, i d = 80a v gs = 10v, r gs = 5.0 ? - - 64 ns t d(on) turn-on delay time - 15 27 ns t r rise time - 16 29 ns t d(off) turn-off delay time - 32 52 ns t f fall time - 14 26 ns t (off) turn-off time - - 78 ns drain-source diode characteristics v sd source to drain diode forward voltage i sd = 80a - 0.99 1.25 v i sd = 40a - 0.88 1.0 v t rr reverse recovery time i s = 40 a, di/dt = 100a/ s - 70 105 ns q rr reverse recovery charge - 202 303 nc notes: 1. pulse test:pulse width<300us,duty cycle<2.0% 2. l=0.13mh, i as = 64a, v dd =50v, r g =25 ? , starting t j =25 o c
FDP3651U n-channel powertrench ? mosfet FDP3651U rev. a www.fairchildsemi.com 3 typical characteristics t j = 25c unless otherwise noted figure 1. on region characteristics 012345 0 20 40 60 80 100 120 pulse duration = 80 s duty cycle = 0.5%max v gs = 8v v gs = 10v v gs = 7v v gs = 20v i d , drain current (a) v ds , drain to source voltage (v) figure 2. normalized 020406080100120 0 1 2 3 4 5 pulse duration = 80 s duty cycle = 0.5%max normalized drain to source on-resistance i d , drain current(a) v gs = 20v v gs = 10v v gs = 8v v gs = 7v on-resistance vs drain current and gate voltage figure 3. -80 -40 0 40 80 120 160 200 0.4 0.8 1.2 1.6 2.0 2.4 2.8 i d = 80a v gs = 10v normalized drain-source on-resistance t j , junction temperature ( o c ) normalized on resistance vs junction temperature figure 4. 8 101214161820 0 10 20 30 40 50 60 pulse duration = 80 s duty cycle = 0.5%max t j = 175 o c t j = 25 o c i d = 80a r ds(on) , on-resistance ( m ? ) v gs , gate to source voltage (v) on-resistance vs gate to source voltage figure 5. transfer characteristics 246810 0 20 40 60 80 100 120 pulse duration = 80 s duty cycle = 0.5%max t j = -55 o c t j = 25 o c t j = 175 o c i d , drain current (a) v gs , gate to source voltage (v) figure 6. 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1e-3 0.01 0.1 1 10 100 1000 t j = -55 o c t j = 25 o c t j = 175 o c v gs = 0v i s , reverse drain current (a) v sd , body diode forward voltage (v) source to drain diode forward voltage vs source current
FDP3651U n-channel powertrench ? mosfet FDP3651U rev. a www.fairchildsemi.com 4 figure 7. 0 102030405060 0 2 4 6 8 10 v dd = 50v v dd = 55v v gs , gate to source voltage(v) q g , gate charge(nc) v dd = 45v gate charge characteristics figure 8. 0.1 1 10 10 0 10 100 1000 10000 f = 1mhz v gs = 0v capacitance (pf) v ds , drain to source voltage (v) c rss c oss c iss capacitance vs drain to source voltage figure 9. 10 -3 10 -2 10 -1 10 0 10 1 10 2 10 3 1 10 100 t j = 25 o c t j = 150 o c i as , avalanche current ( a ) t av , time in avalanche(ms) unclamped inductive switching capability figure 10. 25 50 75 100 125 150 175 0 20 40 60 80 100 i d , drain current (a) t c , case temperature ( o c ) v gs =8v v gs =10v package may limit current in this region maximum continuous drain current vs ambient temperature figure 11. 110100 0.1 1 10 100 10us 500 100us 1ms 10ms dc i d , drain current (a) v ds , drain to source voltage (v) single pulse t j =max rated t c = 25 o c operation in this area may be limited by r ds(on) 200 forward bias safe operating area figure 12. single pulse maximum power dissipation 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 10 2 10 3 10 4 10 5 single pulse v gs = 10v p ( pk ) , peak transient power (w) t, pulse width (s) t c = 25 o c i = i 25 for temperatures above 25 o c derate peak current as follows: 175 t c ? 150 ---------------------- - typical characteristics t j = 25c unless otherwise noted
FDP3651U n-channel powertrench ? mosfet FDP3651U rev. a www.fairchildsemi.com 5 figure 13. transient thermal response curve 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 1e-3 0.01 0.1 1 duty cycle-descending order normalized thermal impedance, z ja t, rectangular pulse duration(s) d = 0.5 0.2 0.1 0.05 0.02 0.01 single pulse 2 p dm t 1 t 2 notes: duty factor: d = t 1 /t 2 peak t j = p dm x z jc x r jc + t c typical characteristics t j = 25c unless otherwise noted
rev. i20 trademarks the following are registered and unregistered trademarks fairch ild semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. disclaimer fairchild semiconductor reserves the right to make changes without further notice to any products herein to improve reliability, function, or design. fai rchild does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. these specifications do not expand the terms of fairchild?s worldwide terms and conditions, specifically the warranty therein, which covers these products. life support policy fairchild?s products are not authorized for use as critical components in life support devices or systems without the express written approval of fairchild semiconductor corporation. as used herein: 1. life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. a critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. product status definitions definition of terms acex? activearray? bottomless? build it now? coolfet? crossvolt ? dome? ecospark? e 2 cmos? ensigna? fact? fast ? fastr? fps? frfet? fact quiet series? globaloptoisolator? gto? hisec? i 2 c? i-lo ? implieddisconnect? intellimax? isoplanar? littlefet? microcoupler? microfet? micropak? microwire? msx? msxpro? ocx? ocxpro? optologic ? optoplanar? pacman? pop? power247? poweredge? powersaver? powertrench ? qfet ? qs? qt optoelectronics? quiet series? rapidconfigure? rapidconnect? serdes? scalarpump? silent switcher ? smart start? spm? stealth? superfet? supersot?-3 supersot?-6 supersot?-8 syncfet? tcm? tinyboost? tinybuck? tinypwm? tinypower? tinylogic ? tinyopto? trutranslation? uhc? unifet? ultrafet ? vcx? wire? across the board. around the world.? the power franchise ? programmable active droop? datasheet identification product status definition advance information formative or in design this datasheet contains the design specifications for product development. specifications may change in any manner without notice. preliminary first production this datasheet contains preliminary data, and supplementary data will be published at a later date. fairchild semiconductor reserves the right to make changes at any time without notice to improve design. no identification needed full production this datasheet contains final specifications. fairchild semiconductor reserves the right to make changes at any time without notice to improve design. obsolete not in production this datasheet contains specifications on a product that has been discontinued by fairchild semiconductor. the datasheet is printed for reference information only.


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